 |
Expedition
Enterprise Brochure º¸±â
|
Expedition Enterpirse µðÀÚÀÎ Flow´Â Áß¼Ò±â¾÷ºÎÅÍ ´ë±â¾÷±îÁöÀÇ High Speed
System Design°ú Ãֽбâ¼úÀÇ PCB µðÀÚÀÎÀ» À§ÇØ ÃÖÀûȵǾî ÀÖ½À´Ï´Ù. ÇöÀç System Deisgn ±â¼úÀÇ ÅëÇÕ ¼Ö·ç¼Ç
Expedition Enterprise´Â constraint, library ¿Í design data management¿¡±îÁö
¾÷°è ÃÖ°íÀÇ ±â¼ú·ÂÀ» ¼±º¸À̰í ÀÖ½À´Ï´Ù.
|
 |
°¡Àå ºü¸¥
time-to-market°ú ÃÖÀûÀÇ ¼³°è µðÀÚÀÎ »ý»ê¼º ±×¸®°í ¼º´ÉÀ» À§ÇÑ °¡Àå ¶Ù¾î³ placement¿Í routing
±â´É |
 |
Manufacturing
communicationÀÇ ÃÖÀûÈµÈ ÀÛ¾÷ÀÇ ¼±Åà ¹× Á¢¼ÓÀÌ °¡´ÉÇÏ°Ô ÇÏ°í ±â¾÷ÀÇ ÀÎÇÁ¶ó¿Í ÀüÀÚ ¾÷°èÀÇ Supply Chain°£ÀÇ
ÅëÇÕ ¼Ö·ç¼Ç
°¡´É |
 |
ÀüÅëÀûÀÎ
MHz routs¿Í multi-gigabit serial interconnetcs¸¦ À§ÇÑ High-speed pre ±×¸®°í post
layout analysis |
 |
HDI/microvia,
embedded components, flex/regid-flex, high pin-count/performance IC pacakge
°°Àº
ÃֽŠPCB ±â¼úÀ» À§ÇÑ µðÀÚÀÎ ¼³°è °¡´É |
 |
FPGAµðÀÚÀÎ
¼Ö·ç¼Ç
Áö¿ø °¡´É. µðÀÚÀÎ Áֱ⸦ ÃÖ¼ÒÈ Çϰí, ½Ã½ºÅÛ ¼º´ÉÀ» ÃÖÀûÈ °¡´É |
 |
°°Àº flow»ó¿¡¼
Çѹø¿¡
¸ðµç Åø¿¡ ´ëÇÑ constraint editing ¹× °ü¸® °¡´É. |
 |
ƯÇãµÈ
°øµ¿ÀÇ team
design technology´Â ÇöÀçÀÇ Lay-out µðÀÚÀÎ Áֱ⸦ 40-70%±îÁö Ãà¼Ò °¡´É. |