IC Design and Circuit Design Verification
ÇöÀç ±¸Çö °¡´ÉÇÑ °¡Àå Á¾ÇÕÀû IC Implementation ȯ°æ
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Manufacturing Variability Solutions
¿ì¸®ÀÇ ÅøÀº cell ¶óÀ̺귯¸® °³¹ßÀ» ½ÃÀÛÀ¸·Î P&R, Physical Verification, ·¹À̾ƿô ÃÖÀûÈ, mask preparation, Å×½ºÆÃ°ú ¿¡·¯ ºÐ¼®¿¡ °ÅÃÄ Àü physical implementation ¶óÀÌÇÁ»çÀÌŬ¿¡ È®ÀåµÇ¾î ÀÖ½À´Ï´Ù. Manufacturing Variability Solutions
IC Design Tools
Olympus Place-and-Route System
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AMS Design, Verification and Layout
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Calibre DFM Platform
°·ÂÇϰí Á¦Ç°¼º´ÉÀÌ Áõ¸íµÈ Hyper scaling ¾ÆÅ°ÅØÃ³¸¦ žÀçÇÑ Calibre´Â ±¤¹üÀ§ÇÏ°í º¸´Ù Á¤È®ÇÏ¸ç ¾÷°è ÃÖ°í ¼º´ÉÀÇ DFM ¼Ö·ç¼ÇÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù.
Calibre IC Verification Platform
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Techpubs and Resources
IC Design Techpubs
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Techpub: : InterconnectionÀÇ ¿µÇâ°ú »¡¶óÁø clock speed·Î crosstalk noise¿Í glitch¿¡ ÀÎÇØ signal delay°¡ ¹ß»ýÇÒ °¡´É¼ºÀ» Áõ°¡µÊ¿¡ µû¶óSignal integrity°¡ ´ëµÎµÇ±â ½ÃÀÛÇß´Ù. 65nm¿Í 45nm design¿¡¼´Â lateral wire cap °ªÀÇ ¿µÇâÀÌ ´Ã¾î³²¿¡ µû¶ó SI¿Í °ü·ÃµÈ timing violationµµ ÇöÀúÇÑ Áõ°¡¸¦ ³ªÅ¸³»°í ÀÖ´Ù. °Ô´Ù°¡ operational mode¿Í process cornerÀÇ °³¼ö°¡ ºü¸£°Ô Áõ°¡ÇÏ¸é¼ ÀÌ·¯ÇÑ ¹®Á¦¸¦ ½ÉȽÃÄÑ design closure¿¡ ¼Ò¿äµÇ´Â ½Ã°£ÀÌ ±Þ°ÝÈ÷ Áõ°¡Çϰí ÀÖ´Ù. Techpub º¸±â
ÃÊÀúÀü·Â µðÀÚÀÎ À§ÇÑ ¸ÖƼ ÄÚ³Ê ¸ÖƼ ¸ðµå ¼Ö·ç¼Ç
Techpub: ÷´Ü ³ëµå ÀúÀü·Â µðÀÚÀÎÀ» ±¸ÇöÇÏ´Â µðÀÚÀ̳ʵéÀº ±¸Çö ¹®Á¦°¡ ¸ÖƼÄÚ³Ê ¸ÖƼ¸ðµå(MCMM), ´ÙÁßÀü¾Ð(¸ÖƼ-Vdd) È帧¿¡¼ ¹ß»ýÇÑ´Ù´Â °ÍÀ» ÀÎÁöÇϰí ÀÖ´Ù. ÀûÀýÇÑ ±¸ÇöÅøÀ» º¸À¯Çϰí ÀÖÀ¸¸ç Å×ÀÌÇÁ ¾Æ¿ôÀ» Á¤½Ã¿¡ ¼öÇàÇϸ鼵µ ½ºÆåÀ» ¹þ¾î³ªÁö ¾ÊÀ» ¼ö ÀÖÁö¸¸ ±×·¸Áö ¾ÊÀ» °æ¿ì Á¦Ç°ÀÌ ´Ê°Ô ³ª¿À°Å³ª Á¦Ç° ¼º´ÉÀÌ ¶³¾îÁö´Â °á°ú¸¦ °Þ°Ô µÈ´Ù. Techpub º¸±â
Critical Feature Analysis as Golden Path to DFM Closure
Techpub: º» ÀÚ·á´Â VDSM(Very Deep Sub-Micron) ·¹À̾ƿô µðÀÚÀÎÀÇ Critical Feature Analysis¸¦ À§ÇØ DFM ¿¡¼ ±¸ÇöµÈ ±â´ÉµéÀ» ´Ù·ç°í ÀÖ½À´Ï´Ù ÀÚ¼¼È÷ º¸±â
Foundry Partners
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Consulting Services
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Customer Success
¡°Calibre´Â µ¶º¸ÀûÀÎ ¼Ö·ç¼ÇÀ¸·Î ¿ì¸®°¡ 0.095 ¸¶ÀÌÅ©·Ð ÇÁ·Î¼¼½º¸¦ À§ÇØ ÃÖÀûÀÇ ±¸ÇöÀ» ÇÒ ¼ö ÀÖµµ·Ï ÇÏ´Â ¼º´É, Á¤È®¼º, ¿ë·®À» Á¦°øÇÕ´Ï´Ù. Calibre´Â ÀÌ¹Ì ¿ì¸®ÀÇ 0.180, 0.150 ¸¶ÀÌÅ©·Ð ±â¼ú¿¡¼ ±¸ÇöµÇ¾úÀ¸¸ç, NEC´Â ÷´Ü ¹ÝµµÃ¼ ÇÁ·Î¼¼½º·Î º¸´Ù ´õ »¡¸® ¹ßÀüÇϰí ÀÖ½À´Ï´Ù. Calibre´Â ¿ì¸®ÀÇ ±â¼ú ¹ßÀüÀ» °¡´ÉÇÏ°Ô ÇÏ´Â Áß¿äÇÑ ±â¼úÀÔ´Ï´Ù.¡±
NEC, System LSI µðÀÚÀÎ ¿£Áö´Ï¾î¸µ ºÎ¼Àå, Kazuhiko Takamizawa ¹Ú»ç
Customer Success
¡°STMicroelectronics´Â ¿ÏÀüÇÑ CMOS 32nm µðÀÚÀÎ ¼Ö·ç¼ÇÀ» Á¦°øÇÏ´Â ±â¼ú ¸®´õ·Î °í°´ÀÇ ÀúÀü·Â µðÀÚÀÎÀ» À§ÇÑ ÃÖÀûÈµÈ µðÀÚÀÎ »ý»ê¼ºÀ» ´Þ¼ºÇÒ ¼ö ÀÖ°Ô Áö¿øÇÕ´Ï´Ù. ¿ì¸®´Â ¿À·£ ÆÄÆ®³ÊÀÎ ¸àÅä¿Í ÇÔ²² ½Å·Ú¼º ÀÖ´Â ecosystemÀ» ±¸ÇöÇÏ¿´½À´Ï´Ù. ¿ì¸®´Â ¿ì¸®ÀÇ Àü¼¼°è µðÀÚÀÎ ÆÀÀ» À§ÇØ µðÀÚÀÎ ¹× ¶óÀ̺귯¸®¸¦ À§ÇÑ °·ÂÇÑ ¼Ö·ç¼ÇÀ» °³¹ßÇÏ¿´½À´Ï´Ù.¡±
STMicroelectronics, ±â¼ú ¿¬±¸ °³¹ß ±×·ì, CMOS ¶óÀ̺귯¸® ±×·ì ÀÌ»ç, Gerard Mas
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