IC Manufacturing
GDSII-to-Mask Flow¸¦ À§ÇÑ ¼Ö·ç¼Ç
¸àÅä´ÂGDSII-to-Mask flowÀÇ ÁÖµÈ ¹®Á¦Á¡À» ÇØ°áÇϴ Ưº°È÷ °³¹ßµÈ ¼Ö·ç¼ÇÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù. ±×¸®ÇÏ¿© ³ôÀº ¿þÀÌÆÛ ¼öÀ²À» À§ÇØ Á¤¹ÐÇÑ CD(critical dimension) Á¦¾î°¡ °¡´ÉÇÏ°Ô Çϰí, ¸¶½ºÅ© Á¦Á¶ ½Ã°£, ºñ¿ë Àý°¨ ¹× »õ·Î¿î ±â¼ú °³¹ß¿¡ ÇÊ¿äÇÑ ½Ã°£°ú ºñ¿ëÀÇ °¨¼Ò¸¦ Áö¿øÇÕ´Ï´Ù.
¸àÅä Åø ÆÐŰÁö´ÂPSM(Phase shift mask), SB(Scattering bars), OPC(optical proximity correction) ó·³ RET(Resolution enhancement )¸¦ À§ÇÑ µ¥ÀÌÅÍ󸮸¦ ºóÆ´¾øÀÌ ÅëÇÕÇßÀ» »Ó¸¸ ¾Æ´Ï¶ó, MRC(Mask Rule Check), MPC(Mask writer Process Correction), µ¥ÀÌÅÍ Æ÷¸Ë º¯È¯±îÁöµµ ÇÑ ¹øÀÇ ½ÇÇุÀ¸·Îµµ °¡´ÉÇÕ´Ï´Ù. ¿ì¸®ÀÇ ¼Ö·ç¼ÇÀº ÀϹÝÀûÀÎ hierarchy database¿Í geometry ó¸® ¿£ÁøÀ» ±â¹ÝÀ¸·Î layer derivation, mirroring, scaling, rotation, planarization fill ±×¸®°í ±Û·Î¹ú/¼±ÅÃÀû »çÀÌ¡°ú °°Àº ±â´ÉÀ» Á¦°øÇÏ¿© GDSII »Ó¸¸ ¾Æ´Ï¶ó MEBES, VSB (Variable-Shaped-Beam) Æ÷¸Ë°ú °°ÀÌ subwavelength ½Ã´ë¿¡ ÷´Ü ¸¶½ºÅ© Á¦À۽à °¡Àå Áß¿äÇÑ ¸¶½ºÅ© »ý¼º Æ÷¸Ë ÇüÅÂÀÇ °á°ú¹°µµ Á¦°øÇÕ´Ï´Ù.
Leading-Edge Mask Enhancement and Fabrication
Áö³ 10³â°£ ¿ì¸®´Â ¼ö½Ê¿© °³ÀÇ fabÀÌ ¸¶½ºÅ© ǰÁúÀ» °³¼±Çϰí design-to-mask TAT(turnaround time)À» °³¼±Çϵµ·Ï Áö¿øÇÏ¿´½À´Ï´Ù.
- ÃÖ°íÀÇ ±â¼ú
- Åø ÀÎÅÍÆäÀ̽º¿Í Çϵå¿þ¾î Ç÷§ÆûÀÇ Æø³ÐÀº ¼±ÅÃÀ» Á¦°øÇÏ´Â À¯¿¬ÇÑ ¼Ö·ç¼Ç
- ¹ÏÀ½Á÷ÇÑ ÆÄÆ®³Ê¿Í Á¶¾ðÀÚ·Î °í°´µéÀÇ ¼º°øÀ» °ßÀÎÇÏ´Â ±â¼úÁö¿ø
Integrated Design-to-Mask Virtual Manufacturing Flow
- ·¹À̾ƿô °ËÁõ
- DFM (Design-For-Manufacturing)
- Á¾ÇÕÀûÀÎ RET (Resolution Enhancement Techniques)
- ÃÖ÷´ÜÀÇ OPC (Optical Proximity Correction) ¿Í °ËÁõ
- Àü¿ë MPC (Mask writer Process Correction)
- Hierarchical MRC (Mask Rule Checking)
- ¸¶½ºÅ© ÇÁ·¢Ãĸµ°ú ¸¶½ºÅ© »ý¼º µ¥ÀÌÅÍ º¯È¯
Open and Accessible
¿ì¸®ÀÇ ¸ðµç ÅøÀº °³¹æÇüÀ¸·Î ´Ù¾çÇÑ ÀÎÅÍÆäÀ̽º¸¦ ÅëÇÏ¿© Á¢¼ÓÇÒ ¼ö ÀÖÀ¸¸ç °í°´ÀÇ ½Å¼ÓÇÑ tapeout-to-mask¸¦ À§ÇÑ ÃÖÀûÈµÈ Ç÷ο츦 Á¦°øÇϰí ÀÖ½À´Ï´Ù.
- Calibre ¿Í OASIS µ¥ÀÌÅͺ£À̽º APIs (Application Programming Interfaces ÀÀ¿ëÇÁ·Î±×·¥ ÇÁ·Î±×·¡¹Ö ÀÎÅÍÆäÀ̽º)
- ³ë±¤ ¹× °èÃø APIs
- ÀϹÝÀûÀÎ rule°ú Á¦¾î ¾ð¾î
IC Manufacturing Design Tools
Calibre® Computational Lithography
Calibre computational lithography solutionÀº ´ÙÁßÀÇ ÇÁ·Î¼¼½º Á¶°Ç¿¡¼ °ß°íÇÏ°í ¾ÈÁ¤ÀûÀÎ Á¦Á¶ ÇÁ·Î¼¼½º¸¦ Áö¿øÇÏ¸é¼ À̹ÌÁö Ãæ½Çµµ¸¦ º¸ÀåÇÏ´Â Çõ½ÅÀûÀ̸ç ÇÙ½ÉÀûÀÎ ±â¼úÀ» Á¦°øÇÕ´Ï´Ù.
Calibre Mask Process Correction
Calibre Mask Process Correction ¼Ö·ç¼ÇÀº ¸àÅäÀÇ Model-Based OPC ±â¼úÀ» Àû¿ëÇÏ¿© Ưº°È÷ e-beam ¸¶½ºÅ© »ý¼º±â¸¦ À§ÇØ ÃÖÀûȵǾú½À´Ï´Ù.
Calibre Mask Data Preparation
¸àÅäÀÇ Mask Data Preparation (MDP) ¼Ö·ç¼ÇÀº Calibre Ç÷§Æû°ú ¿Ïº®ÇÏ°Ô È£È¯µÇ¸ç °øÅëµÈ ¾ð¾î¸¦ »ç¿ëÇÏ¿© ÇϳªÀÇ mask fabrication batch run¾È¿¡¼ Àü resolution enhancement process¿Í ¸¶½ºÅ© µ¥ÀÌÅÍ Æ÷¸Ë º¯È¯ ¾÷¹«°¡ ¿Ï¼ºµÉ ¼ö ÀÖµµ·Ï ÇÕ´Ï´Ù.
Techpubs and Successes
IC Manufacturing Techpubs
A User-programmable Link between Data Preparation and Mask Manufacturing Equipment
Techpub: ¸¶½ºÅ© Á¦Á¶ Àåºñ¸¦ °¡µ¿½ÃŰ¸é¼ µðÀÚÀÎ Áö½ÄÀ» Á¦´ë·Î Ȱ¿ëÇÏ°í µðÀÚÀÎ »ç½½ÀÇ »óÀ§ Á¦Á¶ Á¤º¸¿¡ ´ëÇÑ È¿À²ÀûÀÎ Çǵå¹éÀ» °¡´ÉÇϱâ À§Çؼ¡¦ Techpub º¸±â
Adaptive OPC Approach Based on Image Simulation
Techpub: µðÀÚÀÎ ·êÀÌ ±Þ°ÝÇÏ°Ô ÁÙ¾îµé¸é¼, ĨÀÇ ·¹À̾ƿô ÆÐÅÏÀÌ Áõ°¡ÇÏ¿© °ß°íÇÑ OPC¸¦ À§Çؼ´Â ÈξÀ ´õ ¸¹Àº ½Ã°£À» ÇÊ¿ä·Î Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ ¿Ïº®ÇÑ OPC ¸¦ ±¸ÇöÇϱâ À§Çؼ¡¦ Techpub º¸±â
Model-Based Hints for Litho-Hotspots Repair
Techpub: Litho Ãë¾àºÎÀ§¸¦ ¼öÁ¤Çϱâ À§Çؼ´Â layout ÀÇ edge¸¦ ¾î¶»°Ô ¼öÁ¤ÇØ¾ß Çϴ°¡¿¡ ´ëÇÑ »ç¾çÀÌ ÇÊ¿äÇÕ´Ï´Ù. RuleÀ» ±¸ÇöÇÏ´Â µ¥ ÀÖ¾î¼, Litho Ãë¾àºÎÀ§°¡ ¾øµµ·Ï layoutÀÇ edge¸¦ ¼öÁ¤ÇÏ´Â ¹æ¹ýÀ» ã¾Æ³»´Â °ÍÀÌ ¾î·Æ½À´Ï´Ù. Techpub º¸±â
Executive Brief: Meeting the Critical Challenges of IC Implementation
At the 2008 Design Automation Conference in June, Joseph Sawicki, vice president and general manager of the Design to Silicon Division, laid out Mentor’s strategy to help customers with the challenges they face with IC implementation as they move to smaller process nodes.